· For surface mounted applications
· Glass Passivated Chip Junction
· Fast reverse recovery time
· Ideal for automated placement
· Lead free in comply with EU RoHS 2011/65/EU directives
· Terminals: Solderable per MIL-STD-750, Method 2026
· A 16mg/ 0. 00056oz
| 型號(hào) | 圖片 | 封裝 | VRRM(V) | VRMS(V) | IF(mA) | IFSM(A) | Ptot(mW) | V(BR)R(V) | Cj(pF) | trr(ns) | Tj(℃) | 下載 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
SOD-123 |
250 |
200 |
250 |
1/3/9 |
500 |
250 |
5 |
50 |
-55 to 150 |
|
|
|
|
SOD-123 |
200 |
150 |
250 |
1/3/9 |
500 |
200 |
5 |
50 |
-55 to 150 |
|
|
|
|
SOD-123 |
120 |
100 |
250 |
1/3/9 |
500 |
120 |
5 |
50 |
-55 to 150 |
|
掃一掃，關(guān)注我們
杭州東沃電子科技有限公司 版權(quán)所有 ? 浙ICP備15002169號(hào)-5
歡迎來到杭州東沃電子科技有限公司官方網(wǎng)站
